The highly iterative development of power device process technology has brought more types of wafers, including Taiko wafers, ultra-thin wafers with a thickness as low as 50um, and various wafer warping wafers due to thinning, which poses a huge technical challenge to the robotic handling and transmission transportation system of the probe platform. In the design of the new generation of probe station, independent innovation introduces a variety of modular handling and transmission technology platform modules, which can flexibly and flexibly quickly meet the higher requirements of the customer's process and ensure the yield and system reliability.
