L-9PD

Optical communication probe test system

Suitable for the detection of 2~6 inch LED chips and devices

L-D4COW

Flip LED test system

Using patented needle mechanism, equipped with advanced driving mode, high-precision visual positioning system, the test stroke is compatible with 6-inch chips, and can complete the fully automatic testing of 4-inch or 6-inch uncut wafers

LDM-150-WF

Flip LED testing system

Full-automatic photoelectric testing all-in-one machine that is applied to the flip test of core-level LED chips in batches

L-11DM-PM

Sem-Auto Flip-Chip LED Probing and Testing System

Using patented technology of needle mechanism, equipped with advanced drive mode, high-precision visual positioning system, the test stroke is compatible with 6-inch chips, and can complete the automatic test of 4-inch expansion 1.2 times wafers

L-10MC-W4

Automatic Epi-Up LED Probing and Testing System

It is suitable for the BIN backtest process section after sampling or sorting of large wafers, and can meet the automatic testing of formal 4 and 6-inch LED diced wafers

L-11MC

Automatic Epi-Up LED Probing and Testing System

It is applied to the multi-channel needle card test of the full test of core-level LED full-mounted chips