Integrated high-precision motion platform, ensuring stability and accuracy of chips
Plane support for the test platform, improving absolute rigidity of the platform
Meet test of 20,000 probes, used for multi-core simultaneous detection, improving production capacity and benefits
Four-angle rigidly supported high-strength panels, minimizing deformation of probes under reverse forces
High-precision optical module, combined with the latest image software algorithm, achieving automatic and accurate positioning of probes, and safe and reliable full-automatic test
Automatic card changing, GBIP communication, so as to be combined with mainstream test machines in the market for docking test
Cyclone adsorption technology, solving nondestructive automatic loading and unloading transmission of Taiko\ltrathin\warpage wafers, etc.
CHUCK's modular design, making selection and replacement more convenient and fast