分立器件

PT-9200

8 Inch Automatic Probe Station

High-precision positioning platform (positioning accuracy of ±2 microns)
Meet test of 2,000 probes, used for multi-core simultaneous detection, improving production capacity and benefits
High-precision optical module, combined with the latest image software algorithm, achieving automatic and accurate positioning of probes, and safe and reliable full-automatic test
Through the unique mechanical arm adsorption technology, achieve nondestructive automatic loading and unloading transmission of Taiko\ltrathin\warpage wafers, etc.
CHUCK's modular design, making selection and replacement more convenient and fast
Equipped with a large-size probe grinding table to adapt to different probe grinding manners

Test application

Suitable for wafer testing of integrated circuits and power devices of 8 inches and below

Test application

High-pressure test

Large current test

High-temperature test

Radio frequency test

WAT test

Re-measurement of an NG point

Test under high or low temperature

Main functions

Automatic probe alignment

Automatic wafer alignment

Automatic detection of wafer thickness

CHUCK automatic cleaning

Automatic reading of wafer IDs

Automatic dotting

Probe mark detection

Automatic probe cleaning

Real-time MAP display and product storage

Special application

Notch-free prealignment

Shading treatment

Consultation/Complaint

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Telephone

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female

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