A new generation of high-precision positioning platform (positioning accuracy±2μm)
The open panel design can be matched with different components to achieve more abundant testing functions
The automatic needle matching function is more suitable for the testing needs of multi-core simultaneous testing of integrated circuits and undercut pins
CHUCK options such as normal high temperature, high temperature, and constant temperature
The sampling test function can realize unequal distance stepping on the wafer and test at any point
It has the function of multi-bin classification display mapping, and can arbitrarily analyze the distribution of wafer parameters
The high-precision optical module, combined with the latest image software algorithm, realizes the automatic and accurate positioning of the probe, and the safe, reliable and fully automatic test;
CHUCK modular design, more convenient to choose and replace;