分立器件

Company Profile

Development History

Die probe station

AOI testing equipment

Exposure machine

Automated Testing

Semiconductor Test

Service Support

Quality Control

Enterprise dynamics

Home

Products

PT-308T

PT-308T

8 inch semi-automatic probe station

High-precision positioning platform (positioning accuracy of ±3 microns)
Used for multi-core simultaneous detection, improving production capacity and benefits
Matched with DC probe holders for test, and support installation of 4 probe holders at most
High-precision CCD vision positioning system with great automation
Unique mobile panel, achieving off-site dotting, full scanning, ink dot recognition, automatic accuracy correction, etc.

Test application

Suitable for wafer testing of integrated circuits and power devices of 8 inches and below

Main functions

Automatic wafer alignment

Automatic probe cleaning

Automatic dotting

Probe mark detection

Real-time MAP display and product storage

Test application

High current test

High-pressure test

High-temperature test

Re-measurement of an NG point

Radio frequency test

Shading test

Related Products

8 Inch Automatic Probe Station

8 Inch Automatic Probe Station

Suitable for wafer testing of integrated circuits and power devices of 8 inches and below

8 Inch Automatic Probe Station

Suitable for automatic probe testing of 5~8 inch integrated circuit wafers. The whole machine is specially designed for the test needs of integrated circuit multi-core and multi-probe and high positioning accuracy, which can meet the single-core or multi-core test of less than 2000 probes, and is equipped with a fully automatic loading and unloading system, which has the characteristics of high precision, high rigidity and high stability; Automatic needle alignment improves the alignment accurac

8 inch automatic probe station

8 inch automatic probe station

Suitable for wafer testing of integrated circuits and power devices of 8 inches and below

8 inch automatic probe station

Suitable for automatic probe testing of 5~8 inch integrated circuit wafers. The whole machine is specially designed for the test needs of integrated circuit multi-core and multi-probe and high positioning accuracy, which can meet the single-core or multi-core test of less than 1000 probes, and is equipped with a fully automatic loading and unloading system, which has the characteristics of high precision, high rigidity and high stability. Automatic needle alignment improves the alignment accurac

weixin