光电芯片测试

LDM-150-WF

Flip LED testing system

Integrated design of probe test, reliable test, and high accuracy
Unique image processing algorithm, high efficiency, and more accurate positioning
Active probe pressure adjustment technology, making probe mark control more reliable
Test band can cover ultraviolet (UVC/UVB/UVA), blue, green, yellow, red, and white light, etc. (optional)
The number of test system channels covers single-core and multi-core (optional)
Support multiple current source gears
ESD of multiple specifications
Support conventional electrical parameters, and optical parameters of various specifications
Support Mini and Microv LED gears

Application field

LED chip testing, LED finished module testing

Main functions

Automatic alignment and fast scanning and positioning

Automatic probe cleaning

Real-time display and automatic adjustment of probe pressures by the active edge detector

Automatic probe grinding

Automatically output activation report

Automatic BIN classification of test data

Cavity point positioning (0,0)

Sampling test of optical parameters

Support full test for the outer circle and sampling test for the inner circle

Multi-Mapping real-time display

Support different test conditions for the inner circle and the outer circle

Different test conditions for different channels

Peripheral shrinkage point and shrinkage cavity point

Re-measurement of an NG point

Support connection with MES to automatically load product files

Sampling test of a random point

Sampling test, and then full test

Expansion test, user-defined test, and edge detection test

Test application

Flip LED COT spot test

Flip FQA spot test

Consultation/Complaint

Question Type

Name

Phone

Telephone

Gender

male

female

Company Name

City

Contact address

Content