光电芯片

L-11DM-PM

Flip LED test system

Integrated design of probe test, reliable test, and high accuracy
Unique image processing algorithm, high scanning efficiency, and accurate positioning
Patented automatic gear identification of an integrating sphere, which can be used more easily
Active probe pressure adjustment technology, making probe mark control more reliable
Patented probe adjusting and probe changing structure design, faster operation
Test band covers ultraviolet (UVC/UVB/UVA), blue, green, yellow, red, and white light, etc. (optional)
The number of test system channels covers single-core, 4-core and 8-core (optional)
Support current source gears of various specifications (optional)
A variety of ESD specifications and long ESD service life in the industry (optional)
Support the general electrical parameter test, with optical parameters including WLP/WLD/WLC/HW/PURITY/CIE-x/CIE-y/CCT/RA/R1-R15
Support Mini and Micro LED gears

Application fields

LED chip testing, LED finished module testing

Main functions

Automatic probe cleaning

Automatic alignment and fast scanning and positioning

Real-time display and automatic adjustment of probe pressures by the active edge detector

Automatic probe grinding

Automatically output activation report

Automatic BIN classification of test data

Automatic regional anomaly retest

Sampling test of optical parameters

Different test conditions for the inner circle and the outer circle

Re-measurement of an NG point

Cavity point positioning (0,0)

Support connection with MES to automatically load product files

Sampling test of a random point

Sampling test, and then full test

Expansion test, user-defined test, and edge detection test

Test application

COT full test

Automated factory

Support front automatic line upgrade

Consultation/Complaint

Question Type

Name

Phone

Telephone

Gender

male

female

Company Name

City

Contact address

Content