The precise compensation algorithm is used to ensure the arrangement accuracy of the die bonding position.
BIN ring blue film has no stretching and deformation, ensuring the precision of die bonding.
The nozzle pressure is adjustable and has a very low impact on the chip.
The contact height between the nozzle and the chip is automatically measured and set.
BIN switching comes with a buffer, which greatly reduces the BIN switching time.
It has the function of chip angle detection before sorting and die bonding after position correction.
8 bin cassettes (6 sort bins, 1 empty film magazine, 1 full magazine)
Operator hierarchical permission management.
Wafer & Bin input & output Barcode management
It has the function of detecting surface defects such as product twins and missing corners
When changing products, it has the function of automatic gear adjustment.
It can set the number of poor picking and die bonding, and automatically alarm and stop when the limit is exceeded.
With mixing logic: it can support 12 WAFER and 1 BIN function
It has an anti-sorting function
It can support the customization function of communication interface