Fully automatic design, it can place 4 input magazines and 4 output magazines at one time
Double-station design, to meet the exposure and alignment of the film at the same time
The table is equipped with an adaptive leveling function
It can accurately control the bonding pressure between the mask and the chip
Automatically and quickly complete the coarse alignment of the chip: the chip is aligned, the center of the chip is positioned, and the chip is trimmed
Automatic alignment and positioning of wafers
Multi-template matching to solve the problem of the same product but large color difference
Accuracy of alignment is checked before exposure to ensure reliability
Equipped with a temporary storage box for abnormal pieces to ensure the continuity of equipment operation