GK-120
GK-120
Fully automatic exposure machine
Fully automatic design, which can place 4 input magazines and 4 output magazines at a time;
The double-station turntable design can meet the simultaneous exposure and alignment of the film
Adaptive leveling function
The pressure at which the mask is bonded to the chip is controlled by air pressure
Automatically and quickly locate the center of the chip circle and locate the chip trimming
Model Description

This model can be customized according to the needs of diode chip manufacturers to meet the first exposure of 4, 5 and 6 inch wafers

Fields of application
Wafer contact exposure
Features:
Fully automatic chip exposure
Consultation/Complaint
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